Items Covered
- a.[Reserved]
- b."Technology" for metal-working manufacturing processes, as follows:
- 1. "Technology" for the design of tools, dies or fixtures "specially designed" for any of the following processes:
- 1.a. "Superplastic forming";
- 1.b. "Diffusion bonding"; or
- 1.c. 'Direct-acting hydraulic pressing';
- 2. [Reserved]
- 1. "Technology" for the design of tools, dies or fixtures "specially designed" for any of the following processes:
- c."Technology" for the "development" or "production" of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;
- d.[Reserved]
- e."Technology" for the "development" of integration "software" for incorporation of expert systems for advanced decision support of shop floor operations into "numerical control" units;
- f."Technology" for the application of inorganic overlay coatings or inorganic surface modification coatings (specified in column 3 of the following table) to non-electronic substrates (specified in column 2 of the following table), by processes specified in column 1 of the following table and defined in the Technical Note.
- a.CoCrAlY coatings which contain less than 22% by weight of chromium, less than 7% by weight of aluminum and less than 2% by weight of yttrium;
- b.CoCrAlY coatings which contain 22 to 24% by weight of chromium, 10 to 12% by weight of aluminum and 0.5 to 0.7% by weight of yttrium; or
- c.NiCrAlY coatings which contain 21 to 23% by weight of chromium, 10 to 12% by weight of aluminum and 0.9 to 1.1% by weight of yttrium.
- a.Chemical Vapor Deposition (CVD) is an overlay coating or surface modification coating process wherein a metal, alloy, "composite", dielectric or ceramic is deposited upon a heated substrate. Gaseous reactants are decomposed or combined in the vicinity of a substrate resulting in the deposition of the desired elemental, alloy or compound material on the substrate. Energy for this decomposition or chemical reaction process may be provided by the heat of the substrate, a glow discharge plasma, or "laser" irradiation.
- b.Thermal Evaporation-Physical Vapor Deposition (TE-PVD) is an overlay coating process conducted in a vacuum with a pressure less than 0.1 Pa wherein a source of thermal energy is used to vaporize the coating material. This process results in the condensation, or deposition, of the evaporated species onto appropriately positioned substrates. The addition of gases to the vacuum chamber during the coating process to synthesize compound coatings is an ordinary modification of the process. The use of ion or electron beams, or plasma, to activate or assist the coating's deposition is also a common modification in this technique. The use of monitors to provide in-process measurement of optical characteristics and thickness of coatings can be a feature of these processes. Specific TE-PVD processes are as follows:
- c.Pack Cementation is a surface modification coating or overlay coating process wherein a substrate is immersed in a powder mixture (a pack), that consists of:
- d.Plasma Spraying is an overlay coating process wherein a gun (spray torch) which produces and controls a plasma accepts powder or wire coating materials, melts them and propels them towards a substrate, whereon an integrally bonded coating is formed. Plasma spraying constitutes either low pressure plasma spraying or high velocity plasma spraying.
- e.Slurry Deposition is a surface modification coating or overlay coating process wherein a metallic or ceramic powder with an organic binder is suspended in a liquid and is applied to a substrate by either spraying, dipping or painting, subsequent air or oven drying, and heat treatment to obtain the desired coating.
- f.Sputter Deposition is an overlay coating process based on a momentum transfer phenomenon, wherein positive ions are accelerated by an electric field towards the surface of a target (coating material). The kinetic energy of the impacting ions is sufficient to cause target surface atoms to be released and deposited on an appropriately positioned substrate.
- g.Ion Implantation is a surface modification coating process in which the element to be alloyed is ionized, accelerated through a potential gradient and implanted into the surface region of the substrate. This includes processes in which ion implantation is performed simultaneously with electron beam physical vapor deposition or sputter deposition.
- a.Chemical stripping and cleaning bath cycle parameters, as follows:
- a.For the removal of old or defective coatings corrosion product or foreign deposits;
- b.For preparation of virgin substrates;
- b.Visual and macroscopic criteria for acceptance of the cleaned part;
- c.Heat treatment cycle parameters, as follows:
- a.Composition of the atmosphere;
- b.Pressure of the atmosphere;
- d.Substrate surface preparation parameters, as follows:
- a.Grit composition;
- b.Grit size and shape;
- c.Grit velocity;
- e.Masking technique parameters, as follows:
- a.Atmosphere parameters, as follows:
- b.Time parameters;
- c.Temperature parameters;
- d.Thickness parameters;
- e.Index of refraction parameters;
- f.Control of composition;
- a.Shot peening parameters, as follows:
- b.Post shot peening cleaning parameters;
- d.Post heat treatment visual and macroscopic criteria for acceptance of the coated substrates;
- a.Statistical sampling criteria;
- b.Microscopic criteria for:
- c.Criteria for optical properties assessment (measured as a function of wavelength):
- a.For Chemical Vapor Deposition (CVD):
- b.For Thermal Evaporation-Physical Vapor Deposition (PVD):
- a.Wave length;
- b.Power density;
- c.Pulse length;
- d.Repetition ratio;
- e.Source;
- c.For Pack Cementation:
- d.For Plasma Spraying:
- e.For Sputter Deposition:
- f.For Ion Implantation:
- g.For Ion Plating:
Control Reasons Explained
This ECCN is controlled for the following reasons. Each reason maps to a column on the Commerce Country Chart, which determines whether a license is required for a given destination.
- NSNational Security
- Items that could contribute to the military potential of countries of concern. Check the Commerce Country Chart column for NS to determine license requirements.
- ATAnti-Terrorism
- Basic anti-terrorism controls that apply to most items on the CCL. A license is required for exports to countries designated as state sponsors of terrorism.
Common Questions About 2E003
What does ECCN 2E003 cover?
ECCN 2E003 is an entry on the Commerce Control List (Materials Processing). The List of Items Controlled below describes the products, software, or technology captured by this classification. Compare your item against those parameters when self-classifying.
How do license requirements work for this ECCN?
License need depends on the control reasons shown for this code (for example NS, RS, MT, AT), the destination country, and how your transaction maps against the Commerce Country Chart, de minimis, and other EAR provisions. This page is a research aid only. Confirm against the current rule text and your specific facts before exporting.
Where is the official text for this ECCN?
The legal text appears in Supplement No. 1 to part 774 of the Export Administration Regulations (15 CFR Part 774). Use the official BIS link on this page to open the current supplement entry for this ECCN.
What if my product matches more than one ECCN?
When several ECCNs appear to fit, the controlling entry is usually the one that is most specific to your item's form, function, or technical limits. Cross-references in the List of Items Controlled and related ECCNs listed on this page are common starting points for narrowing the choice.
How often should I re-check this classification?
The Commerce Control List changes when BIS publishes new or amended rules. Revisit the official entry when regulations update, when the product's technical parameters change, or when the destination, end-user, or end-use of a transaction changes.
What do the control reason codes mean?
Each control reason (NS, RS, MT, AT, etc.) maps to a column on the Commerce Country Chart in Supplement No. 1 to part 738 of the EAR. When a control reason applies to your ECCN and the destination country has an X in that column, a license is generally required unless an exception applies. See the Control Reasons Explained section on this page for details on each code.